News

close up of microchip

GW to Advance Next Generation Chip Technologies as Part of $32.7M Center

January 6, 2023

Volker Sorger will lead one of four themes within the new center focused on ultra-dense heterogeneous interconnect and assembly.

close up of microchip

GW Joins $32.7M Semiconductor Packaging, Heterogeneous Integration Center Led by Penn State

January 5, 2023

This new center is focused on improving the performance, efficiency, and capabilities of electronic systems for emerging commercial and defense applications.

Season's greetings

Season's Greetings!

December 22, 2022

A message from Dean Lach

C-BIG Could Make a BIG Impact at SEAS

December 12, 2022

Carles Corbella, a researcher from the GW Department of Mechanical and Aerospace Engineering, has been working on a new research line

PhD student Lingchen Kong and associate professor Xitong Liu

GW Engineering Team Wins Tech Venture Track at 2023 Pitch George Competition

December 5, 2022

SEAS’ Lingchen Kong and Professor Xitong Liu won the Tech Venture Track competition in this year’s Pitch George competition!

John Helveston

To boost solar, the US should use more carrots and fewer sticks

November 11, 2022

Prof. John Helveston recently published an op-ed in The Hill

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GW Engineering Faculty Excellence Awards

October 19, 2022

2022 GW Engineering Faculty Excellence Awards

Dr. Hurriyet Ok awarded the Create with VR grant from Unity and Meta Immersive Learning

September 19, 2022

Dr. Hurriyet Ok awarded the Create with VR grant from Unity and Meta Immersive Learning

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Professor Michael Keidar Published in Science Advances

September 19, 2022

Congratulations to Dr. Michael Keidar, professor of Mechanical & Aerospace Engineering, as well as their team for having their article “Demonstration of electric micropropulsion multimodality” published in Science Advances.

Professor Payman Dehghanian awarded a major NSF contract

September 8, 2022

Professor Payman Dehghanian awarded a major NSF contract