This position is part of the National Institute of Standards (NIST) Professional Research Experience (PREP) program. NIST recognizes that its research staff may wish to collaborate with researchers at academic institutions on specific projects of mutual interest and thus requires that such institutions be the recipients of a PREP award. The PREP program requires staff from a wide range of backgrounds to work on scientific research in many areas. Employees in this position will perform technical work that underpins the scientific research of the collaboration.
Research Title:
Materials Research Engineer (CHIPS Project Title: Modeling for nano-to-microscale mechanical tests on advanced packaging materials)
The work will entail:
The CHIPS Metrology Project “Modeling for nano-to-microscale mechanical tests on advanced packaging materials” is seeking a materials research engineer to perform critical modeling and simulation tasks related to advanced packaging applications. This work will focus primarily on modeling the elastic-plastic response of heterogeneous materials subjected to nanoscale and microscale mechanical tests. We are looking to develop computational models to guide the design of these mechanical tests and better understand the experimental observations of behavior of heterogeneous systems under indentation-type loads. Key parameters to be extracted from modeling are the strength and fracture toughness of the interface between dissimilar materials.
Key responsibilities will include but are not limited to:
- Establishing the geometry and boundary and initial conditions. Investigation of slow-dynamic versus quasistatic nanoindentation in a brittle substrate using peridynamics in 3D.
- Modeling and simulation of elastic and elastoplastic behavior from nanoindentation in a brittle substrate with ductile inclusions near the indentation location.
- Modeling and simulation of fracture behavior from nanoindentation in a brittle substrate with ductile inclusions near the indentation location.
- Analysis of the effects varying the material interface strength and fracture toughness have on the nanoindentation behavior.
- Study on the crack dynamics in the proximity of the material interface.
- Simulate the thermomechanical response of materials commonly used in BEOL applications at the atomic scale and develop connections to nanoscale behavior.
- As needed and appropriate: write reports and/or publications, present findings to CHIPS Project PIs, and attend technical conferences.
Qualifications
- PhD in Materials Science or another related field
- 10 years of experience with computational materials research
- Familiarity with various computational techniques for the elastoplastic behavior of materials (e.g. peridynamics)
- Familiarity with materials commonly used in microelectronic devices and assemblies.
- Independent worker with strong written and oral communication skills
The university is an Equal Employment Opportunity/Affirmative Action employer that does not unlawfully discriminate in any of its programs or activities on the basis of race, color, religion, sex, national origin, age, disability, veteran status, sexual orientation, gender identity or expression, or on any other basis prohibited by applicable law.