In the article "Penn State leads semiconductor packaging, heterogeneous integration center," the Pennsylvania State University announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
Here is an excerpt from the article: "Fourteen university partners — including Georgia Tech; Columbia University; Cornell University; Arizona State University; George Washington University; Massachusetts Institute of Technology; Rice University; Stanford University; University of California, Davis; University of California, Los Angeles; University of California, San Diego; University of Colorado; and University of Illinois, Chicago — will collaborate to advance heterogenous integration, the efficient and effective integration and packaging of semiconductor devices, chips and other components."
Read the full article on the Penn State website.