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Dr. Korman Steps Into New Role at IEEE
January 12, 2023
Congrats to Prof. Can Korman on being selected as Associate Editor for the Institute of Electrical and Electronics Engineers’ Transactions on Magnetics Journal!

GW to Advance Next Generation Chip Technologies as Part of $32.7M Center
January 6, 2023
Volker Sorger will lead one of four themes within the new center focused on ultra-dense heterogeneous interconnect and assembly.

GW Joins $32.7M Semiconductor Packaging, Heterogeneous Integration Center Led by Penn State
January 5, 2023
This new center is focused on improving the performance, efficiency, and capabilities of electronic systems for emerging commercial and defense applications.